Programming a memory device to increase data reliability

ABSTRACT

Methods for programming a memory array, memory devices, and memory systems are disclosed. In one such method, the target reliability of the data to be programmed is determined. The relative reliability of different groups of memory cells of the memory array is determined. The data is programmed into the group of memory cells of the array having a relative reliability corresponding to the target reliability.

RELATED APPLICATIONS

This is a continuation of U.S. patent application Ser. No. 12/981,873filed Dec. 30, 2010 now U.S. Pat. No. 8,077,519 (allowed) and titled“PROGRAMMING A MEMORY DEVICE TO INCREASE DATA RELIABILITY”, that is acontinuation of U.S. application Ser. No. 12/234,956, now U.S. Pat. No.7,864,587, filed Sep. 22, 2008, titled “PROGRAMMING A MEMORY DEVICE TOINCREASE DATA RELIABILITY” and issued as which is commonly assigned andincorporated by reference in its entirety herein.

TECHNICAL FIELD

The present invention relates generally to memory devices and in aparticular embodiment the present invention relates to non-volatilememory devices.

BACKGROUND

Memory devices can include internal, semiconductor, integrated circuitsin computers or other electronic devices. There are many different typesof memory including random-access memory (RAM), read only memory (ROM),dynamic random access memory (DRAM), static RAM (SRAM), synchronousdynamic RAM (SDRAM), and flash memory.

Flash memory devices have developed into a popular source ofnon-volatile memory for a wide range of electronic applications. Flashmemory devices typically use a one-transistor memory cell that allowsfor high memory densities, high reliability, and low power consumption.Common uses for flash memory include personal computers, personaldigital assistants (PDAs), digital cameras, and cellular telephones.Program code and system data such as a basic input/output system (BIOS)are typically stored in flash memory devices for use in personalcomputer systems.

As the performance and complexity of electronic systems increase, therequirement for additional memory in a system also increases. However,in order to continue to reduce the costs of the system, the parts countmust be kept to a minimum. This can be accomplished by increasing thememory density of an integrated circuit.

Memory density in a non-volatile memory can be increased by usingmultiple level cells (MLC). MLC memory can increase the amount of datastored in an integrated circuit without adding additional cells and/orincreasing the size of the die. The MLC method stores two or more databits in each memory cell.

MLC, however, requires tighter control of the threshold voltages inorder to use multiple states per cell. An MLC memory device typicallyhas a higher bit error rate than a single level cell (SLC) memory devicedue, in part, to the increased quantity of states requiring more closelyspaced threshold voltages. A bad bit in a memory device used to storephotographs can be tolerated more easily than a bad bit in a memorydevice that stores code. A bad bit in a photograph might only produce abad pixel out of millions of pixels while a bad bit in code or otherdata could mean a corrupted instruction that affects the operation of anentire program.

For the reasons stated above, and for other reasons stated below thatwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art fora memory device having higher density with increased reliability.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a block diagram of one embodiment of a memory system.

FIG. 2 shows a schematic diagram of one embodiment of a portion of anon-volatile memory array in accordance with the memory array of FIG. 1.

FIG. 3 shows flowchart of one embodiment of a method for programmingdata in a memory array based on reliability determinations.

FIG. 4 shows a flowchart of an alternate embodiment of a method forprogramming data in a memory array based on reliability determinations.

DETAILED DESCRIPTION

In the following detailed description of the invention, reference ismade to the accompanying drawings that form a part hereof and in whichis shown, by way of illustration, specific embodiments in which theinvention may be practiced. In the drawings, like numerals describesubstantially similar components throughout the several views. Theseembodiments are described in sufficient detail to enable those skilledin the art to practice the invention. Other embodiments may be utilizedand structural, logical, and electrical changes may be made withoutdeparting from the scope of the present invention. The followingdetailed description is, therefore, not to be taken in a limiting sense,and the scope of the present invention is defined only by the appendedclaims and equivalents thereof.

FIG. 1 illustrates a functional block diagram of a memory system 120that includes a non-volatile memory device 100. The memory device 100has been simplified to focus on features of the memory that are helpfulin understanding the present programming embodiments. The memory device100 is coupled to an external controller 110. The controller 110 may bea microprocessor or some other type of control circuitry.

The memory device 100 includes an array 130 of non-volatile memorycells, such as the ones illustrated in FIG. 2 and discussedsubsequently. The memory array 130 is arranged in banks of access linessuch as word line rows and data lines such as bit line columns. In oneembodiment, the columns of the memory array 130 are comprised of seriesstrings of memory cells. As is well known in the art, the connections ofthe cells to the bit lines determines whether the array is a NANDarchitecture, an AND architecture, or a NOR architecture.

Address buffer circuitry 140 is provided to latch address signalsprovided through the I/O circuitry 160. Address signals are received anddecoded by a row decoder 144 and a column decoder 146 to access thememory array 130. It will be appreciated by those skilled in the art,with the benefit of the present description, that the number of addressinput connections depends on the density and architecture of the memoryarray 130. That is, the number of addresses increases with bothincreased memory cell counts and increased bank and block counts.

The memory device 100 reads data in the memory array 130 by sensingvoltage or current changes in the memory array columns using senseamplifier circuitry 150. The sense amplifier circuitry 150, in oneembodiment, is coupled to read and latch a row of data from the memoryarray 130. Data input and output buffer circuitry 160 is included forbidirectional data communication as well as address communication over aplurality of data connections 162 with the controller 110. Writecircuitry 155 is provided to write data to the memory array.

Memory control circuitry 170 decodes signals provided on controlconnections 172 from the processor 110. These signals are used tocontrol the operations on the memory array 130, including data read,data write (program), and erase operations. The memory control circuitry170 may be a state machine, a sequencer, or some other type ofcontroller to generate the memory control signals. In one embodiment,the memory control circuitry 170 is configured to perform theprogramming embodiment illustrated in FIG. 3. The memory controlcircuitry 170 is further configured to control the reading of data fromthe memory array 130.

FIG. 2 illustrates a schematic diagram of a portion of a NANDarchitecture memory array 201 comprising series strings of non-volatilememory cells on which the embodiments of the subsequently discussed datatransfer method operate. While the subsequent discussions refer to aNAND memory device, the present embodiments are not limited to such anarchitecture but can be used in other memory device architectures aswell.

The array is comprised of an array of non-volatile memory cells 201(e.g., floating gate) arranged in columns such as series strings 204,205. Each of the cells 201 are coupled drain to source in each seriesstring 204, 205. A word line WL0-WL31 that spans across multiple seriesstrings 204, 205 is connected to the control gates of each memory cellin a row in order to bias the control gates of the memory cells in therow. The bit lines BL1, BL2 are eventually connected to sense amplifiers(not shown) that detect the state of each cell by sensing current on aparticular bit line.

Each series string 204, 205 of memory cells is coupled to a source line206 by a source select gate 216, 217 and to an individual bit line BL1,BL2 by a drain select gate 212, 213. The source select gates 216, 217are controlled by a source select gate control line SG(S) 218 coupled totheir control gates. The drain select gates 212, 213 are controlled by adrain select gate control line SG(D) 214.

Each memory cell can be programmed as a single level cell (SLC) ormultilevel cell (MLC). Each cell's threshold voltage (V_(t)) isindicative of the data that is stored in the cell. For example, in anSLC, a V_(t) of 0.5V might indicate a programmed cell while a V_(t) of−0.5V might indicate an erased cell. The MLC may have multiple V_(t)ranges that each indicate a different state. Multilevel cells can takeadvantage of the analog nature of a traditional flash cell by assigninga bit pattern to a specific voltage range stored on the cell. Thistechnology permits the storage of two or more bits per cell, dependingon the quantity of voltage ranges assigned to the cell.

Data programmed in the memory cells at the top of the memory stringsclosest to the drain side and at the bottom of the memory stringsclosest to the source line has statistically shown a higher bit errorrate than data programmed into other areas of the string. Thus, datathat requires higher reliability could be programmed into the morecentral areas of the memory strings. Data that can tolerate a higher biterror rate can be programmed into the upper and lower areas of thememory strings.

Program code typically cannot tolerate errors in programming. One errorbit could mean the difference between the program operating properly andnot operating at all. Thus, program code would benefit more from beingprogrammed in the higher reliability area of the memory strings.

Image data can typically tolerate a higher error rate. Corrupt imagedata would mean that some pixels of the image would be missing or notdisplay the proper data. However, in an image of many millions ofpixels, a few corrupt pixels would not be noticeable to the averageperson. Thus, image data can be programmed into the areas of the stringwith the higher bit error rate.

One aspect of the reliability of a memory cell is determined by howaccurately it can be programmed to a target threshold voltage and howwell it can then hold that threshold voltage. A memory cell maintaininga target threshold voltage is desired in an MLC device since theprogramming margins are relatively small compared to SLC memory.

The relative reliability (e.g., bit error rate) of an area of memory isrelative in relation to the rest of the memory array. For example, arelatively low reliability area of memory cells has a higher bit errorrate than the rest of the memory array. This area could be, as discussedpreviously, a certain number of word lines that are closer to the drainside of the array and a certain number of word lines that are closer tothe source side of the array. Conversely, a relatively high reliabilityarea of memory cells has a lower bit error rate than the rest of thememory array. This area could be the middle area of the array.

FIG. 3 illustrates a flowchart of one embodiment of a method forprogramming non-volatile memory cells in order to improve programmingreliability. This embodiment assumes that the top-most word lines andthe bottom-most word lines are the least reliable (e.g., have thehighest bit error rate). Alternate embodiments can assume the top two ormore word lines and the bottom two or more word lines are the leastreliable. Additionally, the quantity of less reliable word lines on thetop of the series string does not have to equal the quantity of lessreliable word lines at the bottom of the series string.

Referring to FIG. 3, the type of data to be programmed is determined301. This determination can be done by a controller performing analgorithm to determine whether the data is an image or code. In anotherembodiment, the user can input an indication of the data type orreliability required.

The area of the memory array to be programmed with the data is thendetermined based on a target reliability of the data to be programmed303. As described previously, data requiring a higher reliability isprogrammed in the more central portion of the memory series strings.Data that can tolerate a higher bit error rate is programmed in theouter portions of the series strings.

The actual programming operation is then performed 305 followed by averify operation to determine whether the programming was successful.This operation is performed in response to the type of data (e.g., codeor image) and the determination of the area of memory to be programmed.

During a typical programming operation of a non-volatile memory cell, acontrol gate of the selected memory cell to be programmed is biased witha series of incrementing voltage programming pulses. The initialprogramming pulse starts at an initial voltage that is greater than apredetermined programming voltage (e.g., approximately 16V). Subsequentprogramming pulses are increased incrementally by a step voltage

A verify operation is performed after each programming pulse todetermine if the cell's threshold voltage has increased to the targetprogram level. A verify pulse is typically a ramp voltage that biasesthe selected word lines (i.e., memory control gates) between eachprogramming pulse. The memory cells on the selected word line turn onwhen the ramp voltage reaches the threshold voltage to which the cellshave been programmed. A current flows on the bit lines coupled to thememory cells being programmed when the memory cells turn on. Thiscurrent flow is detected by sense amplifiers that indicate to comparisoncircuitry that a comparison operation should be performed to determineif the data stored in the memory cell is equal to the target data.

In yet another embodiment, illustrated in the flowchart of FIG. 4, theleast reliable word lines of the memory array can be determined byempirical testing of the integrated circuit. This can be accomplished bya series of writing to and reading from different areas of the memoryarray to determine which areas can be programmed more accurately andwhich areas hold a charge better. If a word line of memory cells in themiddle of the series string turns out to have a higher bit error ratethan the other word lines, that particular word line of memory cells isflagged and used for the data that can tolerate the higher error rates.

Referring to FIG. 4, the programming method determines the word lines ofmemory cells of the array that have a higher bit error rate relative tothe other word lines 402. This is accomplished by empirical testing ofthe memory device.

The type of data to be programmed is also determined 404. As in otherembodiments, this can be accomplished by a controller executing analgorithm to determine data type, by user input, or some other datadetermination method.

The data is then programmed 406 in response to the type of data and thedetermination of the areas of different reliability of the memory array.The data that can tolerate a higher bit error rate is programmed intothe less reliable areas whereas the data that cannot tolerate a high biterror rate is programmed into the more reliable areas of the memoryarray.

CONCLUSION

In summary, one or more embodiments store data in areas of a memoryarray based on the target reliability of the data being stored and therelative reliability of the area of memory in which the data is to bestored. Data having a relatively higher reliability target (e.g.,program code) is stored in an area of memory found to be more reliablethan other areas (e.g., the middle portions of series memory strings).Data having a relatively lower target reliability (e.g., image data) isstored in an area of memory found to be less reliable than other areas(e.g., top and bottom word lines of series memory strings).

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe invention will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the invention. It is manifestly intended that thisinvention be limited only by the following claims and equivalentsthereof.

1. A method for programming comprising: programming data into areas of amemory array wherein the areas are determined responsive to a targetreliability of the data wherein data having a first reliability targetis programmed in a central portion of memory series strings and datahaving a second reliability target that is less than the firstreliability target is programmed in an outer portion of the memoryseries strings.
 2. The method of claim 1 wherein the areas comprisememory cells of the memory array that are closest to a drain side of thearray and closest to a source line of the memory array.
 3. The method ofclaim 1 wherein the areas comprise memory cells coupled to a top wordline of the array and memory cells coupled to a bottom word line of thearray.
 4. The method of claim 1 and further comprising receiving aninput corresponding to an indication of the target reliability of thedata.
 5. The method of claim 1 wherein the outer portions of the seriesstrings are closest to a drain side of the array and a source side ofthe array.
 6. The method of claim 1 wherein a relatively high bit errorrate of the data is an indication of relatively low reliability.
 7. Themethod of claim 6 and further comprising receiving a desired bit errorrate as an indication of the target reliability of the data.
 8. A methodfor programming a non-volatile memory device, the method comprising:determining a type of data to be programmed to a memory array comprisingfirst particular memory cells having a first relative reliability thatis greater than a second relative reliability of second particularmemory cells; and programming the data to either the first or the secondparticular memory cells responsive to the first and second relativereliabilities and the type of data.
 9. The method of claim 8 wherein thefirst relative reliability indicates that the first particular memorycells have a lower bit error rate than the second particular memorycells.
 10. The method of claim 8 wherein the second relative reliabilityindicates that the second particular memory cells have a higher biterror rate than the first particular memory cells.
 11. The method ofclaim 8 wherein the first particular memory cells are located in amiddle area of the memory array.
 12. The method of claim 8 wherein thememory array comprises a plurality of series strings of memory cells andfirst memory cells coupled to word lines at the top and the bottom ofeach series string of memory cells are less reliable than memory cellscoupled to word lines between the first memory cells.
 13. A memorydevice comprising: a memory array having relatively high reliabilityareas of memory cells; and memory control circuitry configured tocontrol programming of the memory array, the memory control circuitryconfigured to program the relatively high reliability areas of memorycells with data having a relatively high target reliability, the memorycontrol circuitry is further configured to program image data to areasof the memory array having a relatively low target reliability that islower than the relatively high target reliability.
 14. The memory deviceof claim 13 wherein the memory array comprises a plurality of floatinggate memory cells.
 15. The memory device of claim 13 wherein the memorycontrol circuitry is further configured to perform a program verifyoperation.
 16. A memory device comprising: a memory array havingrelatively high reliability areas of memory cells; and memory controlcircuitry for controlling programming of the memory array, the memorycontrol circuitry configured to program the relatively high reliabilityareas of memory cells with data having a relatively high targetreliability, the memory control circuitry is further configured toprogram basic input/output system (BIOS) data to the relatively highreliability areas of the memory cells.
 17. The memory device of claim 16wherein the memory control circuitry is configured to program the memorycells as one of a single level cell or a multiple level cell.
 18. Thememory device of claim 16 wherein the memory control circuitry isfurther configured to determine which areas of memory cells have therelatively high reliability and which areas of memory cells of thememory array have a relatively low reliability that is less than therelatively high reliability.
 19. A memory device comprising: a memoryarray having relatively high reliability areas of memory cells; andmemory control circuitry for controlling programming of the memoryarray, the memory control circuitry configured to program the relativelyhigh reliability areas of memory cells with data having a relativelyhigh target reliability, the memory control circuitry is furtherconfigured to determine a data type by user input.
 20. The memory deviceof claim 19 wherein the data type comprises image data or program code.